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A process is described for removing fencing and residual photo resist in a thin film structure by means of gel lapping.
English (United States)
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Gel Lapping for Removal of Fencing And Residual Resist
A process is described for removing fencing and residual photo resist in a
thin film structure by means of gel lapping.
A lapping technique in conjunction with a gel is used to remove fencing and
residual resist in the fabrication of thin film structures. The technique requires
thickening a liquid (NMP solvent, for example) with an inert binder (Cab-O-Sil, for
example) to form a viscous gel. The viscous gel is applied to the part, and the
part is lapped with a random motion. The part is then washed with either
deionized water or a suitable solvent.
The technique relies on the viscous shear force exerted by the gel, to break
off loosely adhering debris. This technique has the advantage that no abrasion is
produced of the surface being lapped.