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Substrate Temperature Measurement Using Integral Surface Resistors

IP.com Disclosure Number: IPCOM000058978D
Original Publication Date: 1988-Mar-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Andros, FE Homa, TR Sammakia, BG Vadala, PP [+details]

Abstract

Measuring the temperature distribution on substrates allows the characterization or profiling of components during processing, as well as during the simulation of field conditions. A knowledge of the temperature distribution permits an accurate evaluation of thermal stress. Commonly used techniques to accomplish temperature measurement consist of embedding thermocouples in the module through drilled holes in the cap or substrate. Such techniques have several shortcomings. One shortcoming is that embedding a thermocouple in this manner introduces foreign materials which disturb the thermal field. Also, placement of thermocouples in constricted conditions that are found around a module is difficult. A described temperature measurement technique addresses these problems in the following manner.