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Dimensional Stability Using Pre-set Crimp Angle

IP.com Disclosure Number: IPCOM000058986D
Original Publication Date: 1988-Mar-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Bhatt, AC Doran, DE Hunsinger, LE Shurtleff, JA [+details]

Abstract

Multilayered printed circuit laminates are typically made of woven fiberglass fabric and coated with epoxy resin. This coated fabric serves as a dielectric layer between circuit layers in the laminate. The lamination process, involving heat and pressure, exerts considerable pressure on the laminate and causes the circuit layers to distort making the proper plane-to-plane alignment difficult to achieve. A major cause of this distortion is the crimp angle employed in the manufacture of the glass fabric and the processes used to remove sizing from the fabric.