Browse Prior Art Database

Thermal Conduction Module With Improved Piston for Thermal Transfer Between Chip & Hat Established by Joining an Anodized Aluminum Plate to the End of the Piston

IP.com Disclosure Number: IPCOM000058995D
Original Publication Date: 1988-Mar-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Agonafer, D Eid, JC [+details]

Abstract

A known thermal conduction module (TCM) has a hat that carries pistons that contact semiconductor chips and carry heat from the chips into the hat structure. The pistons are made of metal and insulation is provided to prevent a piston from forming an electrical path between the chip and the hat. Depending on the method of electrical insulation, substantial degradation of the piston thermal performance can result. The conventional solution is to anodize an aluminum piston. It has also been proposed to extrude an aluminum layer over a copper piston and subsequently anodize to take advantage of the thermal improvement of copper.