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Optical Or Visual Tester for Missing Or Misplaced Cooling Pistons In Circuit Module Disclosure Number: IPCOM000058996D
Original Publication Date: 1988-Mar-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue


Related People

Appolonia, MD [+details]


A circuit module called a thermal conduction module (TCM) has a flat dielectric substrate, chips mounted in an array on one surface of the substrate, a component called a hat that cooperates with the substrate to form an enclosure for the module, and cylindrical metal pistons that are carried in the hat and contact the chips for heat transfer. The chips and the substrate are assembled in one set of manufacturing operations, the hat and the pistons are assembled in an independent set of operations, and the substrate assembly and the hat assembly are then combined. All modules have a standard array of chip positions but not all positions carry chips, and different types of modules have different patterns of chips. Similarly, the hat has a standard array of piston positions, but pistons are located only over chips.