Browse Prior Art Database

Internally Decoupled Plastic "Small Outline J" Package

IP.com Disclosure Number: IPCOM000059026D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Bergeron, RJ Starr, SG Tomashot, SW [+details]

Abstract

A method is shown for incorporating a capacitor in a small outline "J" (SOJ) plastic semiconductor package for the purpose of minimizing on chip voltage collapse and reducing electrical ground noise.