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Liftoff Stencil Using Two Distinct Release Layers Disclosure Number: IPCOM000059044D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

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Hockensmith, PA, Jr [+details]


A process modification in the manufacturing of semiconductor devices involves coating a second polysulfone release layer on top of an underlay during liftoff operations. This method does not require tool modification and leads to increased throughput and less potential damage to the product when processed through liftoff.