Browse Prior Art Database

Liftoff Stencil Using Two Distinct Release Layers

IP.com Disclosure Number: IPCOM000059044D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Hockensmith, PA, Jr [+details]

Abstract

A process modification in the manufacturing of semiconductor devices involves coating a second polysulfone release layer on top of an underlay during liftoff operations. This method does not require tool modification and leads to increased throughput and less potential damage to the product when processed through liftoff.