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Chip-in-place testing (CIPT) of semiconductor multi-chip modules (MCM's) utilizing existing probers is enhanced by the addition of a fixture to hold a MCM assembly.
English (United States)
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Fixture for Chip-In-Place Testing of Multi-Chip Semiconductor Modules
Chip-in-place testing (CIPT) of semiconductor multi-chip modules (MCM's)
utilizing existing probers is enhanced by the addition of a fixture to hold a MCM
The current method of verifying a VLSI chip bonding process uses a
mechanical probe arm which carries a probe from one chip location to another
under program control to perform the CIPT. The probe makes contact to the
edge connector pads surrounding the chip under test. For this method of testing,
the module under test is stationary and oriented in a vertical position while the
probe arm moves the probe from the side.
A new method of CIPT of MCM's utilizes an existing Electroglas
2001X or equivalent prober with minor modifications to the Z-stage
assembly. The Z-stage fixture consists of the following components as
shown in the figure:
1) Tester head.
2) Probe card assembly.
3) Probe tips.
4) Chip under test.
5) Multi-chip module.
6) MCM socket.
7) Socket plug board.
8) Fixture to hold socket - MCM assembly.
9) Prober positioner (Z-stage assembly).
10) MCM power cable.
An uncapped MCM 5 to be tested is plugged into MCM socket 6. A probe
card assembly 2 is mounted on the tester head 1 and remains stationary. The
MCM 5 under test moves along with the prober's Z-stage assembly 9 under
program control and the Z-stage assembly 9 is moved up and down during
testing to make contact between the edge connector pads on the MCM 5 and the