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Mechanism for Attaching Standoffs to Module Pins Disclosure Number: IPCOM000059054D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue


Related People

Baker, D Jenkins, J Kolan, H Meranda, KW [+details]


In the manufacture of certain integrated circuit modules, standoffs are placed on certain module pins to maintain critical distance from the printed circuit board during later processing. This article discloses an apparatus for separating standoffs from a bulk supply and installing them on designated pins of an integrated circuit module.