Browse Prior Art Database

Cooling Packet for Electronic Components

IP.com Disclosure Number: IPCOM000059076D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Jones, TL [+details]

Abstract

A method for cooling densely packed Printed Circuit Boards (PCB's) is described.