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Thin Film Ground Plane

IP.com Disclosure Number: IPCOM000059098D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Goodwin, JG [+details]

Abstract

This invention discloses a ground plane attached directly to the bottom of a printed circuit board. It comprises an insulating film 1 that is coated on one side with a thin layer of conducting material 2. The insulating side of the film is attached to the bottom of the circuit board 3, and the exposed conducting material is electrically connected to a ground potential. This helps to meet electrostatic discharge (ESD) requirements.