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Improved Substrate Construction Disclosure Number: IPCOM000059105D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

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Related People

Tong, HM Wang, DW [+details]


The form of construction illustrated is useful as a carrier for integrated circuits and for other substrates having a requirement for a low coefficient of thermal expansion. Also, it is not as brittle as a ceramic or glass substrate.