Browse Prior Art Database

Improved Substrate Construction

IP.com Disclosure Number: IPCOM000059105D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Tong, HM Wang, DW [+details]

Abstract

The form of construction illustrated is useful as a carrier for integrated circuits and for other substrates having a requirement for a low coefficient of thermal expansion. Also, it is not as brittle as a ceramic or glass substrate.