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Substrate Module Construction to Stabilize Internal Thermal Resistance

IP.com Disclosure Number: IPCOM000059108D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Colavito, BC [+details]

Abstract

As illustrated in the Figure, the chip substrate is reflow solder mounted to a second substrate which, in turn, connects the chip to the printed circuit card through the pins of the second substrate. The second substrate may or may not have circuit lines.