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Improving Polyimide-To-Polyimide Laminate Adhesion On Substrates

IP.com Disclosure Number: IPCOM000059109D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Hentz, JG Rickerl, PG Slota, P, Jr Stephanie, JG [+details]

Abstract

During the manufacturing process of forming electronic circuits on ceramic or glass substrates, it is present practice to apply a coating of a type of polyimide to the surface of the substrate first. The polyimide that is preferred for this purpose is the polymer that is formed from the monomers pyromellitic dianhydride and oxydianiline (PMDA-ODA), applied to the substrate surface as a liquid solution of the uncured polyamic acid in a suitable solvent.