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Debris Reduction for Laser Drilling of Green Ceramic Sheets

IP.com Disclosure Number: IPCOM000059146D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Olson, RW [+details]

Abstract

Laser drilling is used to drill vias in green ceramic sheets used in multilayered ceramic packages. A serious problem is the formation of particles of melted ceramic debris, which can partially block the drilled vias. Smaller green sheet particle size substantially reduces the amount of debris left in vias.