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Screening Process to Fabricate Electronic Circuitry Using Conductive Adhesives

IP.com Disclosure Number: IPCOM000059147D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Mahmoud, IS [+details]

Abstract

Polymer thick film materials, e.g., conductors, adhesives, dielectrics, and resistors are increasingly being used to fabricate electronic circuitry. Circuitry packaging normally is done using the following steps: 1. Screen conductor material onto substrate 2. Dry and/or cure the material 3. Screen conductive adhesives 4. Mount components and cure 5. Apply, e.g., spray dip or screen, a dielectric material 6. Cure the dielectric material