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An easily loaded, easily controlled method of dispensing molten solder onto components and circuit boards is described.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
52% of the total text.
Page 1 of 2
Molten Solder Applicator Devices
An easily loaded, easily controlled method of dispensing molten solder onto
components and circuit boards is described.
Fig. 1 illustrates a solder applicator gun which is similar in operation to a "hot
melt glue" gun. It consists of: a heater/ sensor block assembly (A) which is used
to heat, form, contain and sense the solder; a holding cylinder or tube (B) which
supports and contains a solid "stick" of solder (which may also contain flux); a
pressure application device (C) which will apply a measured and controlled
amount of pressure to the stick of solder (D); a "stick" of solder (D) which is
easily loaded into the cylinder (B) and may also contain fluxing chemicals; and an
orifice (E) which is appropriate sized, shaped and located to dispense the desired
amount, shape and location of molten solder onto a component/circuit board.
In operation, the solder stick (D) is loaded into the cylinder (B) and the
heater/sensor (A) is energized. The heater/ sensor is made of a highly heat
conductive material, such as copper, aluminum, beryllium, silver, etc., or their
alloys. The heater/sensor contains a heating source and a sensing device
capable of accurately reading temperature. The temperature of the heater/sensor
is raised nearly the melting point of the solder stick being used. As the actual
dispensing time occurs, the heater momentarily adds additional heat to the
heater/sensor block and solder stick. At the appropriate time, pressure is applied
to the solder stick (D) by the pressure application device (C...