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Enhanced Reliability Bonding for Recessed I/O Pin

IP.com Disclosure Number: IPCOM000059158D
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Darrow, RE Emerick, AJ Larnerd, JD McAskill, RD Schulz, KJ [+details]

Abstract

The metallization 1 formed on the recessed pin head-receiving portion 2 of the pin opening 3 of a ceramic substrate 5 is provided with a integral extension 4 into the concentrically aligned pin neck-receiving portion of the opening 3. As a result, the reliability of the subsequently formed reflow solder bond, not shown, between the metallization 1 and the pin, not shown, in the opening 3 is substantially enhanced.