Enhanced Reliability Bonding for Recessed I/O Pin
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15
The metallization 1 formed on the recessed pin head-receiving portion 2 of the pin opening 3 of a ceramic substrate 5 is provided with a integral extension 4 into the concentrically aligned pin neck-receiving portion of the opening 3. As a result, the reliability of the subsequently formed reflow solder bond, not shown, between the metallization 1 and the pin, not shown, in the opening 3 is substantially enhanced.