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Selective Seeding Technique for Electroless Copper Plating Disclosure Number: IPCOM000059162D
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15

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Related People

Kuczynski, JP Park, JM Gelorme, JD [+details]


A widely-used method today of "activating" or "sensitizing" the insulating surface of a substrate so that an electrical circuit can be "printed" on the substrate surface by an electroless copper plating process involves treating the substrate with a colloidal solution of a mixed noble metal catalyst, called a "seed". However, the seed can be responsible for numerous defects, and it is recognized now that, if the seed can be applied only in those areas where copper deposition is to take place, virtually every defect associated with the additive plating process will be eliminated or reduced substantially.