Browse Prior Art Database

Poly (epoxy-amide-imide) for Electronic Packaging

IP.com Disclosure Number: IPCOM000059163D
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Funari, J Joseph, CA Smey, SL [+details]

Abstract

Vapor phase soldering is commonly used in the fabrication of electronic cards fitted with module packages. This process makes use of solder fluxes which require removal with Dow Chemical Co.'s prelete solvent (A 7% aliphatic alcohol in 1,1,1-trichloroethane) or another chlorinated solvent. These solvents have a deleterious effect on various epoxy encapsulations used on first level modules. An alternate group of materials may be used for encapsulation to eliminate this problem.