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Low Oxygen Content Device for Wafer Thin-Film Anneal Furnace

IP.com Disclosure Number: IPCOM000059180D
Original Publication Date: 1988-Jun-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Curry, MR Schlichting, JP [+details]

Abstract

This invention is for an anneal-furnace modification. In this device there is an inlet port for cool, inert gas (N2 in this case) to be used to purge the furnace and product area.