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Edge Sloping of Via Holes Only Where Metal Will Traverse the Edge

IP.com Disclosure Number: IPCOM000059221D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Cronin, JE Kaanta, CW [+details]

Abstract

By tapering or sloping only those hole edge segments exposed by the metallization mask, line density and conductor contact area are independent of via hole edge slope. This basic technique is beneficially employed in a liftoff process, for example.