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Process for Formation of Conductors at Variable Depths

IP.com Disclosure Number: IPCOM000059224D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Cronin, JE [+details]

Abstract

By a process using a differential photomask to create varying depth images in photoresist, projecting the images into an underlying insulator by a reactive ion etching (RIE) process, and selectively filling the images with a conductor, lines are formed at varying depth in the insulator. By this process, capacitance of lines may be controlled, over-pass or under-pass connections may be made, or selective connections may be made from a lower wiring plane to an upper wiring plane.