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Substrate Seeding Quality And Coverage Test

IP.com Disclosure Number: IPCOM000059232D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Baston, LD Lawrence, WH Reid, JD [+details]

Abstract

Before any glass, epoxy or other electrically nonconductive substrate surface can be used in an electrolysis process, it must be treated in a colloid bath containing a tin palladium mixture to render it at least somewhat conductive. Such a bath is used to "activate" the substrate surface so that the surface can then receive a circuit pattern of copper lines. This initial step of "seeding" a substrate surface is blamed frequently for subsequent problems with the printed circuits, but until now, there has been no way of testing the quality or the coverage of the initial seeding step.