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The method and means disclosed herein is directed to providing an improved low cost thermally enhanced thin film package that can be processed in roll form.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
75% of the total text.
Page 1 of 1
Thermally Enhanced Low Cost Thin Film Package
The method and means disclosed herein is directed to providing an improved
low cost thermally enhanced thin film package that can be processed in roll form.
Present practice involves encapsulating all thin film packages with an
encapsulant such as epoxies, silicones, or epoxy silicones, and although this
technique has been useful in the past, the increased density of the circuits has
rendered the use of thermal enhancements impossible. The present method can
be used to produce a low cost thin film thermally enhanced package that readily
lends itself to automation.
A foil cap, as shown in Fig. 1, is formed by pressing a metal such as
aluminum, copper/invar/copper, or any other malleable metal in a die using
hydraulic pressure and a die rubber. The die rubber insures a wrinkle-free, flat
formed piece. This cap has a depression or bubble in the area over the chip that
is, for example, 25 miles deep with respect to the flat area surrounding the
bubble. Thermal grease is then doctor bladed into the depression and fills the
depression. The thin film circuit is then attached to the cap to provide the
combination shown in Fig. 2, with the cap 1 in the position over the chip 3 and
the intervening space filled with thermal grease. The thin film circuit is then
attached to the cap in one of two ways. In the first way, the cap is centered over
the chip as shown in Fig. 2, and then an encapsulant such as a two-part epoxy,