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Thermally Enhanced Low Cost Thin Film Package

IP.com Disclosure Number: IPCOM000059240D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Funari, J Roody, A Smey, SL [+details]

Abstract

The method and means disclosed herein is directed to providing an improved low cost thermally enhanced thin film package that can be processed in roll form.