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Molded Printed Circuit Boards Embossed for Metallization

IP.com Disclosure Number: IPCOM000059243D
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Graham, AE Leslie, GG Meeks, S, Jr Sullivan, JF [+details]

Abstract

Double-sided printed circuit boards (i.e. interplane or non-interplane) are made by thermal forming of high-temperature polymers. Fabrication may be possible by injection, compression or extrusion molding. These boards are molded with the final circuit design embossed on the outer surfaces. Metallization is then applied directly by filling the grooves with solder paste, thereby potentially eliminating any copper circuitry.