Fabrication of Refractory Electrode Edge Junctions
Original Publication Date: 1988-Jul-01
Included in the Prior Art Database: 2005-Feb-15
Planar and edge junctions of Josephson devices with refractory electrodes can be fabricated with improved stability and less aluminum diffusion than in niobium/aluminum/aluminum oxide/niobium structures by either coevaporating aluminum with niobium or by depositing a thin aluminum layer beneath the niobium base electrode. Low concentrations of aluminum (or magnesium) coevaporated with niobium getter impurities in the niobium without degrading the superconducting properties.