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Copper Peel Sensing Device

IP.com Disclosure Number: IPCOM000059287D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Boich, DZ Gasper, A, Jr Jordan, S Perlini, JJ Perlini, RJ Stowell, RM [+details]

Abstract

A technique is described whereby a sensing device provides a means of testing single and double sided circuit boards during automatic removal of excess copper foil from the circuit board. The concept utilizes continuity sensing and is an improvement over optical or pressure and tension type sensors previously used, as they required frequent adjustments.