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Test Cell for Testing the Through-Hole Electroplating Process

IP.com Disclosure Number: IPCOM000059340D
Original Publication Date: 1988-Aug-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Romankiw, LT Yung, EK [+details]

Abstract

An adjustable-gap plating test cell is described for nondestructive testing of the metal distribution in a through-hole electroplating process.