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An adjustable-gap plating test cell is described for nondestructive testing of the metal distribution in a through-hole electroplating process.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
88% of the total text.
Page 1 of 1
Test Cell for Testing the Through-Hole Electroplating Process
An adjustable-gap plating test cell is described for nondestructive testing of
the metal distribution in a through-hole electroplating process.
Non-uniformity of metal distribution in a through-hole is dependent upon the
current density and agitation of the electroplating solution. A cell is shown in the
Figure in which a rectangular gap 6 is formed between two parallel cathode
members 1 and 2. Preferably, the cathode members are made from #304
stainless steel, but may be of any metal that does not dissolve in the bath or in
the etchant used to strip the copper after completion of test. A high precision
positioning mechanism 3,4 provides vertical movement of the member 1, thereby
adjusting the height of the gap 6. Two OHFC copper anodes 5a and 5b are
symmetrically disposed on one sidewall of the cell in a direction perpendicular to
the cathode members 1,2. An additional pair of anodes (not shown) may be
disposed on the other sidewall. Plating solution is pumped through the cell in the
direction of the arrows. Using the described arrangement, it is possible to obtain
from a single plating test, data concerning the useful range of the polarizations (i-
E) curve for the plating reaction on the exterior of cathode 1 and inside the gap 6.
The apparatus provides a flow-through-hole (gap 6) test capability.
It is also possible to use the cell by replacing the cathode assembly with a
printed circuit board.