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Third Level Metal Diagnostic Image Disclosure Number: IPCOM000059360D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

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Dreibelbis, DH Wissel, L [+details]


A method for utilizing third level metal M3 pad transfer technology to provide an easily probable grid for bench analysis of large, high pin count semiconductor chips is shown.