Browse Prior Art Database

Third Level Metal Diagnostic Image

IP.com Disclosure Number: IPCOM000059360D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Dreibelbis, DH Wissel, L [+details]

Abstract

A method for utilizing third level metal M3 pad transfer technology to provide an easily probable grid for bench analysis of large, high pin count semiconductor chips is shown.