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Post-Cure Cool Down of Polymide Films

IP.com Disclosure Number: IPCOM000059376D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Foster, EM [+details]

Abstract

Variations in the final cure profile used to anneal PMDA-ODA polyimide, commonly used in making polyimide film chip carriers (PFCC), can substantially alter the mechanical properties of the polyimide. The process comprises controlling the rate at which the polyimide is cooled after a final high temperature exposure used to form the polyimide film. The rate at which the polyimide is cooled after the final high temperature exposure can influence the tensile strength, elongation, tear resistance, etc. Films which are cooled quickly have low strengths, while films cooled slowly have high strengths. This can directly affect the performance of products made from this material.