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Bonding Through Insulation Using a Stainless Steel Ribbon As A Shorting Media

IP.com Disclosure Number: IPCOM000059377D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Drotar, JS Funari, J Sholtes, TA [+details]

Abstract

The attachment of an insulated conductor to the pad of a printed circuit board, or the like, by means of welding, soldering or other bonding technique, requires the removal of the insulation before attachment. The removal of the insulation can be achieved by various means, all of which require an additional step. Some of the insulators used, e.g., polyurethanes, can be melted during attachment by soldering or welding, eliminating the need to strip the insulator in an additional step. For those materials that cannot be melted during soldering or welding, e.g., polyimide and Teflon, a method of disintegrating the insulation by heating also eliminates the need for an additional step. The method works as described in the following.