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Technique to Prevent the Formation of Residues During the Manufacture of Printed Circuit Cards

IP.com Disclosure Number: IPCOM000059380D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Daley, LR LaFrese, LC Solomon, JM [+details]

Abstract

In the process of making electrical circuits on cards, boards or substrates of electrically non-conductive material, it has been found that various processes use chemicals that leave conductive residues. Therefore, it would be highly desirable not to have surface imperfections, voids and even clearance holes for forming connections between layers of a multilayered circuit card, that can retain a conductive residue to cause leakage or even a short circuit later.