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Technique to Clean And Prevent Substrate Contamination Disclosure Number: IPCOM000059384D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

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Bitaillou, A Ingraham, AP Lemoine, JM [+details]


This is a procedure for cleaning copper conductors, that are formed on a ceramic substrate, to produce a clean, wettable surface for Controlled Collapse Chip Connection (called "C4") soldering. It also produces a substrate surface on which various conductive elements in solutions, used during subsequent manufacturing steps, will not precipitate.