Browse Prior Art Database

Technique to Clean And Prevent Substrate Contamination

IP.com Disclosure Number: IPCOM000059384D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Bitaillou, A Ingraham, AP Lemoine, JM [+details]

Abstract

This is a procedure for cleaning copper conductors, that are formed on a ceramic substrate, to produce a clean, wettable surface for Controlled Collapse Chip Connection (called "C4") soldering. It also produces a substrate surface on which various conductive elements in solutions, used during subsequent manufacturing steps, will not precipitate.