Technique to Clean And Prevent Substrate Contamination
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16
This is a procedure for cleaning copper conductors, that are formed on a ceramic substrate, to produce a clean, wettable surface for Controlled Collapse Chip Connection (called "C4") soldering. It also produces a substrate surface on which various conductive elements in solutions, used during subsequent manufacturing steps, will not precipitate.