Improved Ball-Limiting-Metallurgy System
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16
The "ball-limiting-metallurgy" is a composite of metallization layers deposited in and around a hole etched through a passivation layer on a semiconductor circuit pattern to facilitate making an electrical contact to an underlying conducting pattern layer. Lead-tin solder is typically deposited onto the BLM and then reflowed (melted) and the chips are subsequently joined to an appropriate substrate interconnection metallization.