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Improved Ball-Limiting-Metallurgy System Disclosure Number: IPCOM000059385D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue


Related People

Agarwala, BN Shih, DY [+details]


The "ball-limiting-metallurgy" is a composite of metallization layers deposited in and around a hole etched through a passivation layer on a semiconductor circuit pattern to facilitate making an electrical contact to an underlying conducting pattern layer. Lead-tin solder is typically deposited onto the BLM and then reflowed (melted) and the chips are subsequently joined to an appropriate substrate interconnection metallization.