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A1cu-Ti-A1Cu Sandwich Process for Metallized Step Coverage

IP.com Disclosure Number: IPCOM000059386D
Original Publication Date: 1988-Sep-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Bauer, HJ Gajda, JH Srikrishnan, K Trudeau, FG [+details]

Abstract

Good metal step coverage is essential to the successful employment of lift-off metallurgies in aluminum-copper (A1-Cu) metallization processes. A sequence of process steps is described in this article which provides both good metal step coverage and resistance against the risk of aluminum spike penetration into silicon contact areas.