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Stress Relief for Tape Automated Bonding (TAB) Tape

IP.com Disclosure Number: IPCOM000059411D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Wustrau, R [+details]

Abstract

Fig. 1 illustrates a scaled-up version of a TAB tape and the specific area of discussion.