Browse Prior Art Database

Tab Heat Sink Rework Tool

IP.com Disclosure Number: IPCOM000059415D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Arldt, BD [+details]

Abstract

A method is described to effectively break the adhesive bond between a silicon chip component and sheet metal heat sink during a rework process.