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A method is described to effectively break the adhesive bond between a silicon chip component and sheet metal heat sink during a rework process.
English (United States)
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Tab Heat Sink Rework Tool
A method is described to effectively break the adhesive bond between a
silicon chip component and sheet metal heat sink during a rework process.
A thermal adhesive is used to bond the chip to the heat sink to assure
thermal conductivity. This bond is broken in order to remove the heat sink and
provide access to the silicon chip carrier device for rework. This method involves
dimpling the sheet metal on the side opposite that of the chip. The dimpling will
deform the sheet metal and break the chip to heat sink interface. The dimple can
be achieved by use of an automatic center punch.