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Technique for Using I-Film Photoresist to Achieve Improvement in Consistency During Manufacture and in Resolution of Lines and Spaces in the Products Disclosure Number: IPCOM000059435D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

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Foster, E Jones, GW Lawrence, WH [+details]


In the manufacture of printed circuits using a photoresist process on a metallic foil that is laminated on a dielectric surface, the time between lamination and subsequent processing is very important in determining the photospeed of the process. As a general rule, it is not desirable to process the resist before it has stabilized, because small differences in processing parameters can translate into large differences in resolution and performance. For this reason, most dry film photoresist manufacturers recommend a holding period of about 15 to 30 minutes between resist lamination and exposure and about the same holding period between exposure and development.