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Enhanced Thermal Performance of Multi-Layer Ceramic Modules

IP.com Disclosure Number: IPCOM000059438D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Anschel, M [+details]

Abstract

It has been found that a diamond layer serves effectively to bridge the high thermal resistance between the back of an integrated circuit silicon chip and, for example, the thermal conductive module piston on multi-layered ceramic modules.