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Enhanced Thermal Performance of Multi-Layer Ceramic Modules Disclosure Number: IPCOM000059438D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

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Anschel, M [+details]


It has been found that a diamond layer serves effectively to bridge the high thermal resistance between the back of an integrated circuit silicon chip and, for example, the thermal conductive module piston on multi-layered ceramic modules.