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Additive Border Generation Disclosure Number: IPCOM000059440D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

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Related People

Czarnecki, KR McKeveny, J Mesley, NN Olmstead, MM [+details]


An additive copper plating process used in the manufacture of printed circuit boards consists of the following steps: 1) Applying a catalytic seeder to a dielectric surface; 2) Applying a photo-resist to this surface; 3) Exposing and developing a circuit image; 4) Additive plating the circuit pattern where the plating is catalyzed by the seeder on the surface; 5) Removing the photo-resist, leaving a printed circuit board.