Browse Prior Art Database

Additive Border Generation

IP.com Disclosure Number: IPCOM000059440D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Czarnecki, KR McKeveny, J Mesley, NN Olmstead, MM [+details]

Abstract

An additive copper plating process used in the manufacture of printed circuit boards consists of the following steps: 1) Applying a catalytic seeder to a dielectric surface; 2) Applying a photo-resist to this surface; 3) Exposing and developing a circuit image; 4) Additive plating the circuit pattern where the plating is catalyzed by the seeder on the surface; 5) Removing the photo-resist, leaving a printed circuit board.