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Precatalyzed Low Dielectric Constant Fluorcarbon Insulators for Rigid And Flexible Printed Wiring

IP.com Disclosure Number: IPCOM000059443D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
McHatton, RC Park, JM White, JR [+details]

Abstract

The materials and method necessary for the preparation of fluorocarbon films which contain an electroless metal plating catalyst are described. The films are suitable for use in the fabrication of high performance, high density printed circuit boards which require limited wet processing prior to electroless metallization/circuitization.