Browse Prior Art Database

Sandwich Composite PCBS for Minimizing Solder Interconnection/Strain

IP.com Disclosure Number: IPCOM000059444D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Chiang, SW Sinclair, NA [+details]

Abstract

A proposal suggests reducing the thermal mismatch between ceramic modules surface mounted on a printed circuit board (PCB) by using multiple PCBs containing differing percentages of metal.