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Sandwich Composite PCBS for Minimizing Solder Interconnection/Strain Disclosure Number: IPCOM000059444D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

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Related People

Chiang, SW Sinclair, NA [+details]


A proposal suggests reducing the thermal mismatch between ceramic modules surface mounted on a printed circuit board (PCB) by using multiple PCBs containing differing percentages of metal.