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Redundancy for Eliminating Electromigration Problems

IP.com Disclosure Number: IPCOM000059446D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Challener, DC Lloyd, JR [+details]

Abstract

Electromigration problems in thin film wiring may be minimized by use of a series of uniform layers of Cu instead of two layers of Cu of different thicknesses.