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Circuit Module With Metal Foil Dividing Chip Space From Liquid Coolant Space And Elastomer Holding Finned Member Against Coolant Side of Foil

IP.com Disclosure Number: IPCOM000059449D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Ventimiglia, B [+details]

Abstract

A circuit module has a flat rectangular chip carrier, an array of chips mounted on the chip carrier, an enclosure, and a thin metal sheet that divides the enclosure into a chip space and a coolant space, as is known. The module will be described with the chip carrier in a horizontal plane and its chip supporting surface uppermost. The enclosure has an upper half that includes the foil and a lower half that includes the chip carrier and these halves are manufactured separately and then assembled. A suitable liquid coolant is circulated through the coolant space to carry the heat from the chips to an external heat sink. The foil is made of soft aluminum. Its lower surface is anodized for electrical insulation and its lower surface is plated with gold.