Browse Prior Art Database

Latch for Processor Enclosure Panel Formed by Blow-Molding and Technique for Attaching the Latch to the Thin Walls of The Enclosure

IP.com Disclosure Number: IPCOM000059451D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Gallagher, RM [+details]

Abstract

A hinged panel for a processor enclosure is formed by blow-molding. At the location for a key operator lock, the panel has a small circular opening where the back wall tacks off against the front wall. The back section forms four circular steps outward to the back wall. A plastic lock mechanism is located in this opening with a keyway section at the small circular hole in the front wall. The lock mechanism press-fits and/or snap-fits into a rotatable drum. The drum snap-fits into a plastic support plate that is welded to the thin wall of the third outer step. The support plate acts as a circular bearing surface for one end of the drum. The plastic lock mechanism rotates on and is supported by the tacked-off front wall.