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Fin for Cooling Circuit Module by Convection and by Impingement of Air Flowing Parallel to the Module Supporting Card

IP.com Disclosure Number: IPCOM000059453D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Graham, NH [+details]

Abstract

A circuit module containing a heat-producing component is mounted on a circuit card and cooled by air that flows across the card and parallel to the generally flat upper surface of the module, as is conventional. A fin is mounted along the upstream edge of the module, across the direction of air flow. The fin can have a thin rectangular shape, and it can have a base that attaches to the module. The fin has a window that is open to the airstream. The material that is cut out of the window forms a generally flat tab that is attached to the top edge of the window. The tab is bent in the downstream direction. The fin is slanted in the downstream direction so that the tab overlies the approximate center of the circuit module and thereby deflects air to about the center of the module to produce impingement cooling.