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An automated method is shown for checking the integrity of all bonds between tape conductors and semiconductor chip I/O pads simultaneously.
English (United States)
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Tape Automated Inspection Technique
An automated method is shown for checking the integrity of all bonds
between tape conductors and semiconductor chip I/O pads simultaneously.
In a semiconductor tab fabrication process, the inner lead bond between tape
conductors and chip I/O pads are formed simultaneously by thermocompression.
The integrity of the bond is checked by cutting out a sample from the tape,
mounting the sample on a frame and mechanically pull testing a few of the leads.
The pull test method does not check every lead, is time consuming, disruptive
A nondestructive and comprehensive test method is disclosed which does
not interrupt the tab fabrication process flow. Referring to the figure, spring
clamps are used on all four sides of the chip to hold down the projecting tabs. A
calibrated air jet around the perimeter of the chip is then directed at the leads in a
direction so as to displace all poorly bonded leads. Displaced leads are detected
later by a pattern recognition system and the part is then rejected. This technique
can be adapted to any chip orientation.