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Tape Automated Inspection Technique

IP.com Disclosure Number: IPCOM000059480D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Beaulieu, PE [+details]

Abstract

An automated method is shown for checking the integrity of all bonds between tape conductors and semiconductor chip I/O pads simultaneously.