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Solder Mask Elimination On Printed Circuit Boards

IP.com Disclosure Number: IPCOM000059493D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-16

Publishing Venue

IBM

Related People

Authors:
Diaz, SJ Glatzel, DH [+details]

Abstract

Solder masks are commonly employed in the photo-processing phases of printed circuit board (PCB) construction to confine the flow of solder to selected areas. One such area of confinement is the terminal pad areas where critical soldering points must be protected against soldering defects. If the mask is defective, these solder defects can occur. A method of production that eliminates the use of a solder mask is achieved using a controlled stream of fluid or air to control the height of the remaining solder and remove the excess solder from the surface of the PCB. The solder mask elimination is also made possible by the optimization of solder equipment by the addition of a hydro-squeegee, air knife or conventional leveling tools to mechanically remove excess solder.