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Method for Determining Bound Vs. Free Water in Alumina Ceramic Chip Carriers Disclosure Number: IPCOM000059498D
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-16

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Anschel, M [+details]


For adhesion management of circuitry and dielectric organic films to ceramic chip carriers, it is imperative that moisture (bound vs. free) content be understood and quantitatively controlled. A rapid, non-destructive, operator-independent moisture analysis of inorganic chip carriers is obtained by using the principles of pulsed nuclear magnetic resonance (NMR) spectroscopy.