Method for Determining Bound Vs. Free Water in Alumina Ceramic Chip Carriers
Original Publication Date: 1988-Nov-01
Included in the Prior Art Database: 2005-Feb-16
For adhesion management of circuitry and dielectric organic films to ceramic chip carriers, it is imperative that moisture (bound vs. free) content be understood and quantitatively controlled. A rapid, non-destructive, operator-independent moisture analysis of inorganic chip carriers is obtained by using the principles of pulsed nuclear magnetic resonance (NMR) spectroscopy.